AMD's MI550 can realistically compete with NVIDIA's Rubin Ultra given superior packaging and HBM4e configuration.
AMD's 2.5D/3D packaging expertise enables 4-die/12 HBM4e design vs NVIDIA's 2-die package; Rubin Ultra delays work in AMD's favor
"MI550 is positioning to challenge Rubin Ultra in 2H27. AMD's 2.5D/3D packaging expertise enables a 4-die/12 HBM4e design, vs Rubin Ultra 2-die package (and MCM for 2 sets of 2-die)." Given that high-capacity HBM4E Rubin Ultra has been delayed, I think MI550 can realistically compete with Rubin Ultra.
| Horizon | Raw move | vs SPY |
|---|---|---|
| 1 day | +4.0% | +3.2% |
| 1 week | +34.3% | +31.4% |
| 1 month | +58.8% | +53.8% |
| 3 months | — | — |
| 6 months | — | — |